Product Introduction
A water channel backing plate is a cooling and support component installed on the back of a sputtering target, featuring a precision water channel structure inside. It efficiently removes the heat generated during the sputtering process by circulating cooling water, maintaining the stability of the target and equipment temperature, preventing thermal deformation or cracking, thus extending the target's lifespan and enhancing the stability and consistency of the thin film deposition process.
For high-power magnetron sputtering, continuous large-area deposition, and extended duty cycles, the water channel backing plate is a critical supporting component. Fabricated from high-purity copper or specialized aluminum alloys, these backplates deliver superior thermal management while maintaining the mechanical strength and corrosion resistance necessary for rigorous industrial use.
Outstanding Features of Water Channel Backing Plate
APG Target utilizes proprietary core technology for the bonding of rotary targets. This advanced process significantly reduces indium consumption while delivering superior interfacial bonding strength. Furthermore, our technology enhances both electrical and thermal conductivity, effectively eliminating common industry challenges such as target delamination and thermal cracking during operation.
Targets produced using this bonding technology can meet the requirements for high-power sputtering. Our AZO rotary targets promise a sputtering power of >15KW/M.
The advanced bonding technology can effectively reduce the amount of indium used, which lowers the cost of the targets.
We design and produce water channel copper backing plates for customers and provide bonding services.
Technical Characteristics
Bonding Adhesion
＞98%
Application Fields
Rotary Target Bonding
Planer Target Bonding
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