Product Introduction
Inductor core paste is a high-performance functional medium formulated from soft magnetic alloys (such as Fe-based amorphous powders), specialized epoxy resins, and active diluents. Engineered for filling or precision printing, the material achieves high magnetic permeability and minimal core loss upon curing. Its robust magnetic profile is specifically optimized for high-frequency and elevated-temperature operational environments.
Core Advantages
● High Heat Resistance
Glass transition temperature >150°C, with some products capable of withstanding temperatures up to 200°C, ensuring stability in high-temperature environments.
● High Fillability and Flowability
Optimized alloy powder grading with multiple particle sizes, achieving high solid content filling, avoiding cracking or void formation during curing.
● Process-Friendly
Viscosity is adjustable, suitable for filling PCB vias or embedded forming on substrates, simplifying the integration process.
Application Areas
This material is primarily utilized in the fabrication of Fully Integrated Voltage Regulators (FIVR), planar inductors, and embedded magnetic substrates. It serves as a critical technology enabler for high-performance power electronics in AI servers, hyperscale data centers, and Next-Generation Vehicle (NGV) power modules.
Technical Specifications
Technical Characteristics
Solid Content (wt%):
70~75
Viscosity (Pa·S):
60±20
Fineness (90%):
≤7.5μm
Application Fields
Magnetic Bead
Multi-layer Chip Inductors
High-Frequency Inductor
Common Mode Inductor
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