Product Introduction
Target Bonding Adhesive is a specialized adhesive used to securely bond sputtering targets to the backing plate. It plays a key role in processes such as physical vapor deposition (PVD).
Core Advantages
● Process Friendly
It typically cures at temperatures from medium to low, avoiding potential damage to target material properties from high temperatures, and is relatively easy to operate.
● Stress Buffering
With certain flexibility, it effectively alleviates stress generated between the target and the backing plate due to differences in thermal expansion coefficients.
● Overall Performance Stability
It has good chemical and mechanical stability, strong adhesion to various substrates (such as aluminum, copper, stainless steel, glass), and is environmentally friendly and non-toxic.
Application Fields
● Ceramic and Brittle Target Bonding
Especially suitable for bonding ceramic targets such as ITO (Indium Tin Oxide) and SiO?, which are brittle and require bonding for support and heat dissipation.
● Thermally Sensitive or Special Targets
Suitable for targets that cannot withstand high-temperature bonding (such as certain oxide targets), organic targets, or temporary bonding applications.
Technical Characteristics
Customizable Development
Application Fields
Target Bonding
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